This work analyzes the role of processing parameters oil the electrical performance of GIZO (Ga(2)O(3):In(2)O(3):ZnO) films and thin-film transistors (TFTs). Parameters Such as oxygen partial pressure, deposition pressure, target composition. thickness. and annealing temperature are studied. Generally, better devices are obtained when low oxygen partial pressure is used. This is related to the damage induced by oxygen ion bombardment and very high film's resistivity when higher oxygen partial pressures are used. Low deposition pressures and targets with richer indium compositions led to films with high carrier concentration, resulting in transistors with field-effect mobility as high as similar to 80 cm(2)/Vs but poor channel conductivity modulation, becoming, ineffective as, switching, devices. Nevertheless, it is demonstrated that reducing the GIZO thickness from 40 to 10 run greatly enhances the switching behavior of those devices. due to the lower absolute number of free carriers, and hence to their easier depletion. Annealing also proves to be crucial to control device performance. significantly modifying GIZO electrical resistivity and promoting local atomic rearrangement. being the optimal temperature determined by the as-produced films, properties. For the best-performing transistors, even with a low annealing temperature (150 degrees C), remarkable properties such is mu(FE) = 73.9 cm(2)/Vs. on/off ratio approximate to 7 X 10(7), V(T) approximate to 0.2 V, and S = 0.29 V/dec are achieved.