Nowadays, adhesively bonded structures have received exhaustive attention mainly because, contrary to mechanical joints, they are able to avoid stress concentration. When a material is externally bonded to another structural member to improve the strength or stiffness of the latter, the adhesive joint is supposed to perform well for a long time, independently of the type of loading the bonded joint will be subjected to. However, studies dedicated to this topic are scarce when it comes to the influence of thermal action. The influence of temperature variations on bonded joints is not yet well understood, so more studies are needed to improve the current level of knowledge. The present study aims to develop an analytical solution capable of simulating the interfacial bond behaviour between two structural materials subjected to thermal loading. The complete debonding processes of such adhesively bonded joints are estimated based on a bi-linear bond–slip relationship. The proposed analytical model is validated by the numerical simulation of several examples, where some parameters previously identified as potentially affecting the bond behaviour are investigated. A commercial software based on the Finite Element Method (FEM) is used to support those examples in which either the analytical or the numerical simulations agreed very well.
- Finite element analysis
- Non-linear analytical model