Role of the deposition parameters in the uniformity of films produced by the plasma-enhanced chemical vapour deposition technique

The objective of this work is to present an analytical model able to interpret the experimental dependence of the uniformity of films produced by the plasma-enhanced chemical vapour deposition technique on the deposition parameters (discharge pressure, gas flow temperature and rf power density). The model proposed is based on the Navier-Stokes equations applied to a gas flow considered to be quasi-incompressible and quasi-inviscous, whenever the Mach number is below 0·3. This condition leads to the establishment of the proper quasisteady-state gas flow equations, and the corresponding equations of energy and momentum balance ascribed to the mass profile of the species formed, under the presence of a low-rf-power plasma density, are able to predict the uniformity distribution of the film over the entire deposited substrate area.