Role of soldering parameters on the electrical performances presented by Cu-Sn-Cu joints used in power diodes

R. Martins; Jorge Ricardo da Costa Ferreira; C. Gonçalves; P. Nunes; E. Fortunato; A. P. Marvão; J. I. Martins

doi:10.1016/S0921-5093(00)00871-6

Role of soldering parameters on the electrical performances presented by Cu-Sn-Cu joints used in power diodes

R. Martins, Jorge Ricardo da Costa Ferreira, C. Gonçalves, P. Nunes, E. Fortunato, A. P. Marvão, J. I. Martins

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

The effects of Sn thickness electrodeposited over Cu on the structural and morphological performance of the joints formed were investigated. The electrical stability of the joints formed was analyzed under extreme aggressive conditions. Results indicated that the proposed soldering technology greatly satisfied the demands concerning soldering specifications.

Original language	English
Pages (from-to)	275-279
Number of pages	5
Journal	Materials Science And Engineering A-Structural Materials Properties Microst
Volume	288
Issue number	2
DOIs	https://doi.org/10.1016/S0921-5093(00)00871-6
Publication status	Published - Sept 1999

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title = "Role of soldering parameters on the electrical performances presented by Cu-Sn-Cu joints used in power diodes",

abstract = "The effects of Sn thickness electrodeposited over Cu on the structural and morphological performance of the joints formed were investigated. The electrical stability of the joints formed was analyzed under extreme aggressive conditions. Results indicated that the proposed soldering technology greatly satisfied the demands concerning soldering specifications.",

author = "R. Martins and Ferreira, {Jorge Ricardo da Costa} and C. Gon{\c c}alves and P. Nunes and E. Fortunato and Marv{\~a}o, {A. P.} and Martins, {J. I.}",

year = "1999",

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T1 - Role of soldering parameters on the electrical performances presented by Cu-Sn-Cu joints used in power diodes

AU - Martins, R.

AU - Ferreira, Jorge Ricardo da Costa

AU - Gonçalves, C.

AU - Nunes, P.

AU - Fortunato, E.

AU - Marvão, A. P.

AU - Martins, J. I.

PY - 1999/9

Y1 - 1999/9

N2 - The effects of Sn thickness electrodeposited over Cu on the structural and morphological performance of the joints formed were investigated. The electrical stability of the joints formed was analyzed under extreme aggressive conditions. Results indicated that the proposed soldering technology greatly satisfied the demands concerning soldering specifications.

AB - The effects of Sn thickness electrodeposited over Cu on the structural and morphological performance of the joints formed were investigated. The electrical stability of the joints formed was analyzed under extreme aggressive conditions. Results indicated that the proposed soldering technology greatly satisfied the demands concerning soldering specifications.

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DO - 10.1016/S0921-5093(00)00871-6

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JO - Materials Science And Engineering A-Structural Materials Properties Microst

JF - Materials Science And Engineering A-Structural Materials Properties Microst

IS - 2

ER -

Role of soldering parameters on the electrical performances presented by Cu-Sn-Cu joints used in power diodes

Abstract

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