The aim of this paper is to present results concerning the morphology, structure, mechanical and electrical characteristics of the new proposed Cu-Sn metallurgical alloy, which may be used in electronic joins. By proper choice of process temperature and pressure. Cu coated surfaces are soldered using Sn as pre-form. The main results achieved indicate that the formation of Cu(3)Sn phase begins at a temperature of about 473 K and that the Sn thickness (d(Sn)) needed is slightly above 7 mum. Due to join wettability, higher temperatures (between 523 and 573 K) and d(Sn) above 35 mum are required to form joins within the specifications of the electronic industry.