Production of low cost contacts and joins for large area devices by electrodeposition of Cu and Sn

J. Ferreira; H.  Seiroco; Francisco Manuel Braz Fernandes; Rodrigo Ferrão de Paiva Martins; Elvira Maria Correia Fortunato; A. P. Marvão; José Inácio Martins

doi:10.1016/S0169-4332(00)00627-9

Production of low cost contacts and joins for large area devices by electrodeposition of Cu and Sn

J. Ferreira, H. Seiroco, Francisco Manuel Braz Fernandes, Rodrigo Ferrão de Paiva Martins, Elvira Maria Correia Fortunato, A. P. Marvão, José Inácio Martins

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

The aim of this paper is to present results concerning the morphology, structure, mechanical and electrical characteristics of the new proposed Cu-Sn metallurgical alloy, which may be used in electronic joins. By proper choice of process temperature and pressure. Cu coated surfaces are soldered using Sn as pre-form. The main results achieved indicate that the formation of Cu(3)Sn phase begins at a temperature of about 473 K and that the Sn thickness (d(Sn)) needed is slightly above 7 mum. Due to join wettability, higher temperatures (between 523 and 573 K) and d(Sn) above 35 mum are required to form joins within the specifications of the electronic industry.

Original language	English
Pages (from-to)	292-295
Number of pages	4
Journal	Applied Surface Science
Volume	168
Issue number	1-4
DOIs	https://doi.org/10.1016/S0169-4332(00)00627-9
Publication status	Published - 15 Dec 2000

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@article{1d1b63fd4caf49b08ded7b241396efef,

title = "Production of low cost contacts and joins for large area devices by electrodeposition of Cu and Sn",

abstract = "The aim of this paper is to present results concerning the morphology, structure, mechanical and electrical characteristics of the new proposed Cu-Sn metallurgical alloy, which may be used in electronic joins. By proper choice of process temperature and pressure. Cu coated surfaces are soldered using Sn as pre-form. The main results achieved indicate that the formation of Cu(3)Sn phase begins at a temperature of about 473 K and that the Sn thickness (d(Sn)) needed is slightly above 7 mum. Due to join wettability, higher temperatures (between 523 and 573 K) and d(Sn) above 35 mum are required to form joins within the specifications of the electronic industry.",

keywords = "lead-free, intermetallic phase, power diode, soldering, electrodeposition",

author = "J. Ferreira and H. Seiroco and {Braz Fernandes}, {Francisco Manuel} and Martins, {Rodrigo Ferr{\~a}o de Paiva} and Fortunato, {Elvira Maria Correia} and Marv{\~a}o, {A. P.} and Martins, {Jos{\'e} In{\'a}cio}",

year = "2000",

month = dec,

day = "15",

doi = "10.1016/S0169-4332(00)00627-9",

language = "English",

volume = "168",

pages = "292--295",

journal = "Applied Surface Science",

issn = "0169-4332",

publisher = "North-Holland | Elsevier",

number = "1-4",

}

TY - JOUR

T1 - Production of low cost contacts and joins for large area devices by electrodeposition of Cu and Sn

AU - Ferreira, J.

AU - Seiroco, H.

AU - Braz Fernandes, Francisco Manuel

AU - Martins, Rodrigo Ferrão de Paiva

AU - Fortunato, Elvira Maria Correia

AU - Marvão, A. P.

AU - Martins, José Inácio

PY - 2000/12/15

Y1 - 2000/12/15

N2 - The aim of this paper is to present results concerning the morphology, structure, mechanical and electrical characteristics of the new proposed Cu-Sn metallurgical alloy, which may be used in electronic joins. By proper choice of process temperature and pressure. Cu coated surfaces are soldered using Sn as pre-form. The main results achieved indicate that the formation of Cu(3)Sn phase begins at a temperature of about 473 K and that the Sn thickness (d(Sn)) needed is slightly above 7 mum. Due to join wettability, higher temperatures (between 523 and 573 K) and d(Sn) above 35 mum are required to form joins within the specifications of the electronic industry.

AB - The aim of this paper is to present results concerning the morphology, structure, mechanical and electrical characteristics of the new proposed Cu-Sn metallurgical alloy, which may be used in electronic joins. By proper choice of process temperature and pressure. Cu coated surfaces are soldered using Sn as pre-form. The main results achieved indicate that the formation of Cu(3)Sn phase begins at a temperature of about 473 K and that the Sn thickness (d(Sn)) needed is slightly above 7 mum. Due to join wettability, higher temperatures (between 523 and 573 K) and d(Sn) above 35 mum are required to form joins within the specifications of the electronic industry.

KW - lead-free

KW - intermetallic phase

KW - power diode

KW - soldering

KW - electrodeposition

U2 - 10.1016/S0169-4332(00)00627-9

DO - 10.1016/S0169-4332(00)00627-9

M3 - Article

SN - 0169-4332

VL - 168

SP - 292

EP - 295

JO - Applied Surface Science

JF - Applied Surface Science

IS - 1-4

ER -

Production of low cost contacts and joins for large area devices by electrodeposition of Cu and Sn

Abstract

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