On the metallurgical joining mechanism during ultrasonic spot welding of NiTi using a Cu interlayer

Wei Zhang, Sansan Ao, J. P. Oliveira, Chunjie Li, Zhi Zeng, Anqi Wang, Zhen Luo

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

Ultrasonic spot welding of NiTi shape memory alloy with Cu interlayer was performed to understand the metallurgical joining mechanism at the materials’ interface. Dynamic recrystallization of the Cu foil and high strain rate of the process induced a nano-scale transition layer composed of NiTiCu phase. The formation of this new phase occurs due to the frictional heating and shear deformation that is imposed by the ultrasonic vibration and contributes to the metallurgical bonding between the parent materials. Mechanical tension tests revealed that the joint with Cu interlayer presents enhanced strength.

Original languageEnglish
Pages (from-to)414-417
Number of pages4
JournalScripta Materialia
Volume178
DOIs
Publication statusPublished - 15 Mar 2020

Keywords

  • Dynamic recrystallization
  • Shape memory alloys (SMA)
  • Tension test
  • Weld

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