New metallurgical systems for electronic soldering applications

C. Gonçalves; J. Ferreira; E. Fortunato; I. Ferreira; R. Martins; A. P. Marvão; J. I. Martins; T. Harder; R. Oppelt

doi:10.1016/S0924-4247(98)00305-7

New metallurgical systems for electronic soldering applications

C. Gonçalves, J. Ferreira, E. Fortunato, I. Ferreira, R. Martins, A. P. Marvão, J. I. Martins, T. Harder, R. Oppelt

DCM - Departamento de Ciência dos Materiais

Research output: Contribution to journal › Article › peer-review

7 Citations (Scopus)

Abstract

The aim of this paper is to present results on a new soldering process based on the low-temperature solidification of intermetallic phases from the system Cu-Sn-Cu which can be employed to form a heat-resistant die-attach as well as signal and power electric contacts. Because of the total transformation into intermetallic phase, the working temperature of the bond formed is several hundred degrees Celsius higher than the process temperature (around 250°C). This process leads to a homologous temperature T/T_m of about 0.3 compared to 0.7 in the case of soft SnAg solder alloy. Therefore a better reliability of the proposed bonding process is achievable. Results of the match of the predicted volume fraction of the intermetallic forms and the experimentally measured contact volume would be also discussed, for contacts formed in power diodes.

Original language	English
Pages (from-to)	70-76
Number of pages	7
Journal	Sensors and Actuators A: Physical
Volume	74
Issue number	1
DOIs	https://doi.org/10.1016/S0924-4247(98)00305-7
Publication status	Published - 20 Apr 1999

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title = "New metallurgical systems for electronic soldering applications",

abstract = "The aim of this paper is to present results on a new soldering process based on the low-temperature solidification of intermetallic phases from the system Cu-Sn-Cu which can be employed to form a heat-resistant die-attach as well as signal and power electric contacts. Because of the total transformation into intermetallic phase, the working temperature of the bond formed is several hundred degrees Celsius higher than the process temperature (around 250°C). This process leads to a homologous temperature T/Tm of about 0.3 compared to 0.7 in the case of soft SnAg solder alloy. Therefore a better reliability of the proposed bonding process is achievable. Results of the match of the predicted volume fraction of the intermetallic forms and the experimentally measured contact volume would be also discussed, for contacts formed in power diodes.",

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AU - Gonçalves, C.

AU - Ferreira, J.

AU - Fortunato, E.

AU - Ferreira, I.

AU - Martins, R.

AU - Marvão, A. P.

AU - Martins, J. I.

AU - Harder, T.

AU - Oppelt, R.

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N2 - The aim of this paper is to present results on a new soldering process based on the low-temperature solidification of intermetallic phases from the system Cu-Sn-Cu which can be employed to form a heat-resistant die-attach as well as signal and power electric contacts. Because of the total transformation into intermetallic phase, the working temperature of the bond formed is several hundred degrees Celsius higher than the process temperature (around 250°C). This process leads to a homologous temperature T/Tm of about 0.3 compared to 0.7 in the case of soft SnAg solder alloy. Therefore a better reliability of the proposed bonding process is achievable. Results of the match of the predicted volume fraction of the intermetallic forms and the experimentally measured contact volume would be also discussed, for contacts formed in power diodes.

AB - The aim of this paper is to present results on a new soldering process based on the low-temperature solidification of intermetallic phases from the system Cu-Sn-Cu which can be employed to form a heat-resistant die-attach as well as signal and power electric contacts. Because of the total transformation into intermetallic phase, the working temperature of the bond formed is several hundred degrees Celsius higher than the process temperature (around 250°C). This process leads to a homologous temperature T/Tm of about 0.3 compared to 0.7 in the case of soft SnAg solder alloy. Therefore a better reliability of the proposed bonding process is achievable. Results of the match of the predicted volume fraction of the intermetallic forms and the experimentally measured contact volume would be also discussed, for contacts formed in power diodes.

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New metallurgical systems for electronic soldering applications

Abstract

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