New adhesion process based on lead-free solder applied in electronic power devices

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The aim of this paper is to present a set of electric data concerning the performances before and after ageing of Cu-Sn-Cu joins used to solder power diodes and to compare the results achieved with the ones obtained in diodes soldered using the conventional technology. The set of results achieved show that the Cu-Sn-Cu joins present even better performances than the ones exhibited by diodes soldered using the conventional technology, without requiring the use of Mo discs to be inserted between the silicon crystal and the metal contacts (stud or finger) to compensate thermal mismatches.
Original languageEnglish
Title of host publicationADVANCED MATERIALS FORUM I
Pages92-95
Volume230-2
DOIs
Publication statusPublished - 1 Jan 2002
Event1st International Materials Symposium (Materials 2001) - Universidade de Coimbra, Coimbra, Portugal
Duration: 9 Apr 200111 Apr 2001

Publication series

NameKEY ENGINEERING MATERIALS
Volume230-2
ISSN (Electronic)1013-9826

Conference

Conference1st International Materials Symposium (Materials 2001)
CountryPortugal
CityCoimbra
Period9/04/0111/04/01

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