Mechanical deformation-aware TFT modeling for highly flexible wearable electronics design

Slobodan Mijalković, Ahmed Nejim, Pedro Barquinha, Ian Scott

Research output: Contribution to journalConference articlepeer-review


A modeling methodology and design tools for mechanical deformation-aware design of highly flexible wearable electronics are presented, A new 3D TCAD meshing tool is developed to explore the effects of bending on electrical characteristics of IGZO TFTs for e-fiber applications. A generic meta-modeling approach to extend the standard SPICE TFT models for mechanical deformation-aware circuit simulation and design is proposed.

Original languageEnglish
Pages (from-to)1905-1908
Number of pages4
JournalDigest of Technical Papers - SID International Symposium
Issue number1
Publication statusPublished - 1 Jan 2018
EventSID Symposium, Seminar, and Exhibition 2018, Display Week 2018 - Los Angeles, United States
Duration: 20 May 201825 May 2018


  • 3D TCAD Simulation
  • Circuit design
  • Mechanical deformation
  • SPICE TFT models
  • TFT compact modeling
  • Wearable electronics


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