Abstract
A modeling methodology and design tools for mechanical deformation-aware design of highly flexible wearable electronics are presented, A new 3D TCAD meshing tool is developed to explore the effects of bending on electrical characteristics of IGZO TFTs for e-fiber applications. A generic meta-modeling approach to extend the standard SPICE TFT models for mechanical deformation-aware circuit simulation and design is proposed.
Original language | English |
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Pages (from-to) | 1905-1908 |
Number of pages | 4 |
Journal | Digest of Technical Papers - SID International Symposium |
Volume | 49 |
Issue number | 1 |
DOIs | |
Publication status | Published - 1 Jan 2018 |
Event | SID Symposium, Seminar, and Exhibition 2018, Display Week 2018 - Los Angeles, United States Duration: 20 May 2018 → 25 May 2018 |
Keywords
- 3D TCAD Simulation
- Circuit design
- Mechanical deformation
- SPICE TFT models
- TFT compact modeling
- Wearable electronics