Low-temperature thermal conductivity of highly porous copper

G. Tomás, Daniel Martins, D. Cooper, G. Bonfait

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)
21 Downloads (Pure)

Abstract

The development and characterization of new materials is of extreme importance in the design of cryogenic apparatus. Recently Versarien® PLC developed a technique capable of producing copper foam with controlled porosity and pore size. Such porous materials could be interesting for cryogenic heat exchangers as well as of special interest in some devices used in microgravity environments where a cryogenic liquid is confined by capillarity. In the present work, a system was developed to measure the thermal conductivity by the differential steady-state mode of four copper foam samples with porosity between 58% and 73%, within the temperatures range 20 - 260 K, using a 2 W @ 20 K cryocooler. Our measurements were validated using a copper control sample and by the estimation of the Lorenz number obtained from electrical resistivity measurements at room temperature. With these measurements, the Resistivity Residual Ratio and the tortuosity were obtained.

Original languageEnglish
Title of host publicationAdvances in Cryogenic Engineering
Subtitle of host publicationProceedings of the Cryogenic Engineering Conference (CEC) 2015
EditorsP. Kittel , M. Sumption
Place of PublicationBristol
PublisherIOP Publishing Ltd.
Volume101
DOIs
Publication statusPublished - 18 Dec 2015
Event2015 Joint Cryogenic Engineering and International Cryogenic Materials Conferences (CEC/ICMC 2015) - Tucson, United States
Duration: 28 Jun 20152 Jul 2015

Publication series

NameIOP Conference Series: Materials Science and Engineering
PublisherIOP Publishing Ltd.
Number1
Volume101
ISSN (Print)1757-8981

Conference

Conference2015 Joint Cryogenic Engineering and International Cryogenic Materials Conferences (CEC/ICMC 2015)
Abbreviated titleCEC/ICMC 2015
CountryUnited States
CityTucson
Period28/06/152/07/15

Keywords

  • Thermal conductivity

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