Abstract

The measurement of deformations, displacements, strain fields and surface defects in many material tests in Civil Engineering is a very important issue. However, these measurements require complex and expensive equipment and the calibration process is difficult and time consuming. Image processing could be a major improvement, because a simple camera makes the data acquisition and the analysis of the entire area of the material under study without requiring any other equipment like in the traditional method. Digital image correlation (DIC) is a method that examines consecutive images, taken during the deformation period, and detects the movements based on a mathematical correlation algorithm. In this paper, block-matching algorithms are used in order to compare the results from image processing and the data obtained with linear voltage displacement transducer (LVDT) sensors during laboratorial load tests of T-beams.
Original languageEnglish
Title of host publicationDoCEIS 2011: Technological Innovation for Sustainability
EditorsL. M. Camarinha-Matos
Place of PublicationBerlin, Heidelberg
PublisherSpringer Verlag
Pages286-293
ISBN (Electronic)978-3-642-19170-1
ISBN (Print)978-3-642-19169-5
DOIs
Publication statusPublished - 2011
Event2nd IFIP WG 5.5/SOCOLNET Doctoral Conference on Computing, Electrical and Industrial Systems - Costa da Caparica, Portugal
Duration: 21 Feb 201123 Feb 2011

Publication series

NameIFIP Advances in Information and Communication Technology
PublisherSpringer Verlag
Volume349
ISSN (Print)1868-4238
ISSN (Electronic)1868-422X

Conference

Conference2nd IFIP WG 5.5/SOCOLNET Doctoral Conference on Computing, Electrical and Industrial Systems
CountryPortugal
CityCosta da Caparica
Period21/02/1123/02/11

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Keywords

  • Block Motion Estimation
  • Digital Image Correlation
  • image processing

Cite this

Almeida, G., Melício, F., Chastre, C., & Fonseca, J. M. M. R. D. (2011). Displacement Measurements with ARPS in T-Beams Load Tests. In L. M. Camarinha-Matos (Ed.), DoCEIS 2011: Technological Innovation for Sustainability (pp. 286-293). (IFIP Advances in Information and Communication Technology; Vol. 349). Berlin, Heidelberg: Springer Verlag. https://doi.org/10.1007/978-3-642-19170-1_31