Development of a simple bond-slip model for joints monitored with the DIC technique

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3 Citations (Scopus)

Abstract

The monitoring of structures has undergone important advances with the improvements of digital cameras available on the market. Thus, the Digital Image Correlation (DIC) technique has become a viable way of studying engineering problems. Recently it has been used in the debonding failure process between the reinforcement and the substrate. The methods or methodologies that should be followed to obtain the results associated to the debonding phenomenon using the DIC technique need to be better understood and studies on this topic are scarce. The present work therefore proposes a new and inexpensive method to monitor the interfacial behaviour between a reinforcement material and a substrate by combining the use of the DIC technique and a simplified nonlinear bond-slip model. For the validation of the proposed method, a series of single-lap shear tests with a sufficient long bond length carried out by the authors are used. Based on the slip distribution obtained from the DIC technique, it was found that a third-degree polynomial function can be used to approximate the interfacial bond-slip curve of the joint. The validation of the model is made with several analytical solutions using the proposed bond-slip model.

Original languageEnglish
Pages (from-to)1535-1546
Number of pages12
JournalArchives of Civil and Mechanical Engineering
Volume18
Issue number4
DOIs
Publication statusPublished - Sep 2018

Keywords

  • Bond
  • Bond-slip model
  • Closed-form solution
  • DIC technique
  • Interfaces

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