Amorphous multicomponent dielectric based on the mixture of high band gap and high k materials, respective devices and manufacture

High performance thin-film, transistors entirely processed at temperatures not exceeding 150°C, using amorphous multi component dielectrics based on t.he mixture of high band gap and high dielectric constant ( K) materials are presented in this invention. The invention relates to the use of sputtered or ink jet printed mixed dielectric materials such as Ta2O5 with SiO2 or Al2O3 or HfO2 with SiO2 or Al2O3. These multicomponent dielectrics allow producing amorphous dielectrics to be introduced in high stable electronic devices with low leakage currents, while preserving a high dielectric constant. This results in producing thin film transistors with remarkable electrical properties, such as the ones produced based on Ga-In-Zn oxide as channel layers and where the dielectric was the combination of the mixture Ta2O5:SiO2, exhibiting field- effect mobility exceeding 35 cm2 V-1 s-1, close to 0 V turn- on voltage, on/off ratio higher than 106 and subthreshold slope below 0.24 V dec-1.