A Multi-branch Linear Amplification with Nonlinear Components Technique

João Guerreiro, Rui Dinis, Paulo Montezuma, João P. Oliveira, Mario Silva

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Single carrier modulations with high order constellations or orthogonal frequency division multiplexing (OFDM) modulations can be employed to obtain spectrally efficient communications. However, such modulations lead to signals with large envelope variations, where the amplification is challenging and usually energy-inefficient. The linear amplification with nonlinear components (LINC) makes use of two efficient, nonlinear power amplifiers for an efficient amplification. In this work, we propose the multi-branch LINC (MB-LINC) technique, which allows the use of highly-efficient nonlinear amplifiers without increasing the nonlinear distortion effects, even if the amplifiers are not balanced 1 .

Original languageEnglish
Title of host publication2018 IEEE Military Communications Conference, MILCOM 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages888-892
Number of pages5
ISBN (Electronic)9781538671856
DOIs
Publication statusPublished - 2 Jan 2019
Event2018 IEEE Military Communications Conference, MILCOM 2018 - Los Angeles, United States
Duration: 29 Oct 201831 Oct 2018

Publication series

NameIEEE Military Communications Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Volume2019-October
ISSN (Print)2155-7578

Conference

Conference2018 IEEE Military Communications Conference, MILCOM 2018
CountryUnited States
CityLos Angeles
Period29/10/1831/10/18

Keywords

  • Amplification
  • Energy efficiency
  • OFDM
  • PAPR

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  • Cite this

    Guerreiro, J., Dinis, R., Montezuma, P., Oliveira, J. P., & Silva, M. (2019). A Multi-branch Linear Amplification with Nonlinear Components Technique. In 2018 IEEE Military Communications Conference, MILCOM 2018 (pp. 888-892). [8599732] (IEEE Military Communications Conference; Vol. 2019-October). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MILCOM.2018.8599732