@inproceedings{53a6285183f841e3b8285b7675fada45,
title = "A Load Balancing Mechanism for 3D Network-on-Chip with Partially Vertically Connected Links",
abstract = "3D integrated circuit was presented as a new solution to enhance the efficiency and expand the capabilities of modern integrated circuit as well. Studies have shown that in comparison with 2D NoCs, the proposed 3D NoC offers a lower power consumption, shorter delay and high performance due to the reduction of the connection length in 3D NoCs. In this article, we present a routing algorithm for heterogeneous 3D NoC which distributes the chip traffic in the whole network based on the global congestion information. This is achieved by finding the least congested minimal path between the communicating nodes. For vertical connections, we consider the Through-Silicon-Vias (TSV) and to avoid deadlock, we use two virtual channels. The results show that the proposed mechanism is superior in comparison with the Elevator-First algorithm in the similar working condition.",
keywords = "3D integration, Latency, Load-balancing, Thermal Distribution, Vertical Channels",
author = "Shiva Majidzadeh",
note = "Publisher Copyright: {\textcopyright} 2023, The Author(s), under exclusive license to Springer Nature Switzerland AG.; 14th IFIP WG 5.5/SOCOLNET Advanced Doctoral Conference on Computing, Electrical and Industrial Systems, DoCEIS 2023 ; Conference date: 05-07-2023 Through 07-07-2023",
year = "2023",
doi = "10.1007/978-3-031-36007-7_19",
language = "English",
isbn = "978-3-031-36006-0",
series = "IFIP Advances in Information and Communication Technology",
publisher = "Springer",
pages = "259--267",
editor = "Camarinha-Matos, {Lu{\'i}s M.} and Filipa Ferrada",
booktitle = "Technological Innovation for Connected Cyber Physical Spaces",
address = "Netherlands",
}