Engineering & Materials Science
Secondary ion mass spectrometry
100%
Diamonds
93%
III-V semiconductors
77%
Cesium
66%
Substrates
66%
Acetylene
63%
Bias voltage
58%
Electronegativity
55%
Chemical vapor deposition
54%
Argon
53%
Titanium
45%
Carbon
44%
Ions
43%
Heat treatment
40%
Coatings
35%
Secondary emission
27%
Steel
27%
Plasma enhanced chemical vapor deposition
22%
Dispensers
22%
Negative ions
21%
Raman spectroscopy
20%
Ionization
20%
Depth profiling
19%
X ray photoelectron spectroscopy
19%
Glass
18%
Film growth
18%
Plasmas
18%
Contact angle
17%
Atoms
16%
Chemical analysis
15%
Stainless steel
13%
Data acquisition
13%
Oxygen
12%
Crystalline materials
12%
Methane
10%
Iron
10%
Deposition rates
10%
Interfacial energy
9%
Control systems
9%
Temperature
9%
Film thickness
8%
Wetting
7%
Austenitic stainless steel
7%
Thin films
7%
Liquids
5%
Physics & Astronomy
diamonds
74%
secondary ion mass spectrometry
68%
ion emission
60%
secondary emission
53%
acetylene
52%
cesium
50%
carbon
39%
titanium
38%
argon
36%
vapor deposition
36%
steels
34%
atmospheres
33%
coatings
31%
electric potential
25%
dispensers
22%
ions
21%
stainless steels
20%
negative ions
16%
data acquisition
15%
bombardment
14%
glass
13%
Raman spectroscopy
13%
photoelectron spectroscopy
12%
diffusion length
12%
ionization
10%
methane
10%
manipulators
10%
profilometers
10%
augmentation
9%
oxygen
9%
iron
8%
wettability
8%
atoms
7%
surface energy
7%
polarity
7%
x rays
7%
chemical composition
6%
temperature
6%
film thickness
6%
chambers
6%
Chemistry
Diamond
89%
Negative Secondary Ion
78%
Ion Emission
69%
Electronegativity
50%
Acetylene
43%
Chemical Vapour Deposition
42%
Vapor Deposition Process
38%
Semiconductor
35%
Voltage
34%
Liquid Film
30%
Secondary Ion
29%
Carbon Atom
29%
Diffusion
28%
Cluster Ion
28%
Coating Agent
28%
Work Function
27%
Mixture
20%
Depth Profiling
19%
Ionization
18%
Plasma
13%
Glass Substrate
13%
Methane
12%
Surface
9%
X-Ray Photoelectron Spectroscopy
9%
Length
9%
Ion
9%
Interfacial Energy
6%
Dioxygen
6%
Polarity
5%
Raman Spectroscopy
5%