Howard, E. L.,
Pourkheirollah, H.,
Pinheiro, C.,
Laia, C. A. T.,
Parola, A. J.,
Mäntysalo, M. &
Lupo, D.,
2023,
FLEPS 2023: IEEE International Conference on Flexible and Printable Sensors and Systems. New Jersey:
Institute of Electrical and Electronics Engineers (IEEE),
4 p. (IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review